Under CopyrightSchletz, AndreasAndreasSchletzBayer, Christoph FriedrichChristoph FriedrichBayerHutzler, AaronAaronHutzler2022-03-1427.5.20212021https://publica.fraunhofer.de/handle/publica/41124210.24406/publica-fhg-411242enpower semiconductorsDC-link capacitorelectrical insulationdie attachhigh temperature670620530Temperature Challenges for Integrated Systems due to High Power Densitypresentation