Aschenbrenner, R.R.AschenbrennerOstmann, A.A.OstmannBeutler, U.U.BeutlerSimon, J.J.SimonReichl, H.H.Reichl2022-03-032022-03-031995https://publica.fraunhofer.de/handle/publica/18610310.1109/96.386270en621Electroless Nickel/Copper plating as a new bump metallizationjournal article