Lorenz, ErikErikLorenzGehre, JoshuaJoshuaGehreJäckel, LindaLindaJäckelSchuster, JörgJörgSchuster2023-09-182023-09-182023https://publica.fraunhofer.de/handle/publica/45077410.1109/IITC/MAM57687.2023.101547052-s2.0-85164154329We present a numerical method for the simulation of vapor deposition processes in complex 3D microstructures, which couples a raytracing-based particle Monte Carlo transport model with Level Set methods for thin film growth. Through the incorporation of different particle-surface interaction models, our method models a wide range of deposition techniques, including Physical Vapor Deposition (PVD), Chemical Vapor Deposition and Atomic Layer Deposition (ALD). We demonstrate our method on trench filling with a two-step copper resputter PVD process and a model ALD process.enmonte-carlo simulationsraytracingthin filmsvapor depositionconference paper