Wiemer, MaikMaikWiemerBraeuer, J.J.BraeuerBesser, J.J.BesserGeßner, ThomasThomasGeßner2022-03-112022-03-112009https://publica.fraunhofer.de/handle/publica/365293enTrends in 3D Integration of MEMS and Electronicsconference paper