Gerstner, H.H.GerstnerHeckel, T.T.HeckelEndruschat, A.A.EndruschatRosskopf, A.A.RosskopfEckardt, B.B.EckardtMärz, M.M.März2022-03-142022-03-142017https://publica.fraunhofer.de/handle/publica/40206210.1109/WiPDA.2017.8170564This paper presents a novel procedure to determine the internal gate-source voltage inside a multi-chip power module using the example of a SiC half bridge module. Based on the lumped elements of the gate circuit calculated by a quasi-static electromagnetic simulation, each field-effect transistor is represented by a single, voltage dependent capacitor. The procedure is validated by clamped inductive switching measurements of a SiC power module. Moreover, it is applied to determine the maximum permissible gate-source voltage range in compliance with the manufacturer's voltage rating for a given driver-module combination. In this context a significant extension of the gate drive voltage range and thus an increase of efficiency using impedance specific PWM patterns is demonstrated.en670620530SiC power module loss reduction by PWM gate drive patterns and impedance-optimized gate drive voltagesconference paper