Driel, W.D. van2022-03-022022-03-022018978-1-5386-2358-9978-1-5386-2359-6978-1-5386-2360-2https://publica.fraunhofer.de/handle/publica/16279419th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018