Parametrized models for a RF chip-to-substrate interconnect

Doerr, I.I.DoerrHwang, L.-T.L.-T.HwangSommer, G.G.SommerOpermann, H.H.OpermannLi, L.L.LiPetras, M.M.PetrasKorf, S.S.KorfSahli, F.F.SahliMyers, T.T.MyersMiller, M.M.MillerJohn, W.W.John2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/339049en621Parametrized models for a RF chip-to-substrate interconnectconference paper