Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes

Schreier-Alt, T.T.Schreier-AltSehnert, J.J.SehnertRebholz, C.C.RebholzMichel, B.B.MichelAnsorge, F.F.Ansorge2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/350333en621620Measurement and Simulation of Stress on Microsystems Induced during Packaging Processesconference paper