Mechanical bumping for flip chip attach on Silicon; GaAs-Devices

Eldring, J.J.EldringZakel, E.E.ZakelReichl, H.H.Reichl2022-03-082022-03-081993https://publica.fraunhofer.de/handle/publica/321246en621Mechanical bumping for flip chip attach on Silicon; GaAs-Devicesconference paper