Hiller, K.K.HillerWiemer, M.M.WiemerHahn, R.R.HahnKaufmann, C.C.KaufmannKurth, S.S.KurthKehr, K.K.KehrGessner, T.T.GessnerDötzel, W.W.DötzelMilekhin, A.A.MilekhinFriedrich, M.M.FriedrichZahn, D.D.Zahn2022-03-092022-03-091999https://publica.fraunhofer.de/handle/publica/333727en621Fabrication of high frequency microscanners by using low temperature silicon wafer bondingconference paper