Schünemann, M.M.SchünemannJam, A.K.A.K.JamGroßer, V.V.GroßerLeutenbauer, R.R.LeutenbauerBauer, G.G.BauerSchäfer, W.W.SchäferReichl, H.H.Reichl2022-03-092022-03-092000https://publica.fraunhofer.de/handle/publica/33497110.1109/ECTC.2000.853232Many industrial branches other than automotive industry may benefit from MEMS technology. Most of them require custom-designed MEMS in mid-scale volumes, which are at present not available at acceptable costs. A modular MEMS packaging and interface concept may contribute to less costly solutions with faster time to market. A 3D stackable packaging concept, the Top-Bottom Ball Grid Array TB-BGA, which includes electric, fluidic, optic, and communication interfaces, is proposed. Several realization technologies (LTCC, 3D-BGA, StackPack) as well as first applications are discussed.enMEMSSchnittstelleHalbleiter670conference paper