Leonhard, W.W.LeonhardGemmler, A.A.GemmlerHeck, W.W.HeckJordan, M.M.JordanGust, W.W.Gust2022-03-092022-03-092000https://publica.fraunhofer.de/handle/publica/335609A plating concept for the deposition of SnAg (Ag 2.5 - 3.5 wt %) was developed and successfully implemented into a substrate bumping technology. Reliable wetting of Al-Pads (AlSi1 or AlSi1Cu0.5, respectively) on the chips can be achieved by a Ni/Au- finish on the pads. Reliability tests (thermal cycles, humid warmth) were performed with good results.enBleifreies LotFlipchip-Technologieflipchip technologylead-free soldereutektisches Zinn-Silber-Loteutektisches Zinn-Zink-Loteutectic tin-silver-alloyeutectic tin-zinc-alloy670conference paper