18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

2022-03-022022-03-022017978-1-5090-4344-6978-1-5090-4343-9978-1-5090-4345-3https://publica.fraunhofer.de/handle/publica/16129518th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017