Schönecker, A.A.SchöneckerGebhardt, S.S.GebhardtSchlenkrich, F.F.SchlenkrichEndler, I.I.EndlerMeissner, F.F.MeissnerMichaelis, A.A.MichaelisMayer-Uhma, T.T.Mayer-UhmaUhlig, S.S.Uhlig2022-03-102022-03-102007https://publica.fraunhofer.de/handle/publica/356353Ceramic films gain more and more importance for the preparation of integrated functional components in planar design. The required film thickness depends on the design of the envisaged circuit or micro system and covers the wide range between 10 nm to 150 micron. Fraunhofer Institute for Ceramic Technologies and Systems (IKTS) has built the experimental basis (screen printing, CSD, CVD, PVD, RIE and CMP) for the development of functional films, covering a wide range of chemical composition, film thickness and process windows. This allows for innovations in two directions, the screening of new layer material systems with specific physical or chemical properties and the development of advanced nano- and microsystems of increased functionality. The main focus on functional integration is presently on Si wafer and low temperature co-fired ceramics (LTCC). IKTS operates a complete LTCC production line, which is the basis for product developments and pilot production of advanced ceramic microsystems. The results on film processing and feasibility studies on integrated device structures are summarized in this paper. Entnommen aus <a_href="http://www.fiz-technik.de/db/b_tema.htm" target="_blank">TEMA</a>enkeramisches SubstratSilicium-WaferMikrosystemtechnikSiebdruckverfahrenCVD-Beschichtenreaktives IonenätzenPVD-BeschichtenBleizirkonattitanatferroelektrische DünnschichtZrO2Al2O3GoldPlanartechnologie620conference paper