Ndip, I.I.NdipSchneider-Ramelow, M.M.Schneider-RamelowHuhn, M.M.HuhnBrandenburger, F.F.BrandenburgerHempel, M.M.HempelLang, K.-D.K.-D.Lang2022-03-142022-03-142018https://publica.fraunhofer.de/handle/publica/40772110.1049/cp.2018.04502-s2.0-85057329041We model, simulate and quantify the impact of integrating bond wire antennas (BWAs) on multilayered stack-ups at millimeter-wave frequencies. The BWAs are fabricated and measured in the 60 GHz band. Very good correlation is obtained between measurement and simulation results.en621conference paper