Krus, MartinMartinKrusSedlbauer, Klaus PeterKlaus PeterSedlbauer2022-05-232022-05-232022https://publica.fraunhofer.de/handle/publica/41791010.1016/b978-0-12-816513-3.00019-8Interior insulation can cause mold problems especially with inappropriate workmanship. Three causes can be named: convective flow with indoor air behind the insulation, gaps in the insulation system, and the thermal bridge effect of interior walls or ceilings. With the help of hygrothermal calculations, it is shown that a convective flow behind the insulation as well as gaps must be avoided. However, the interior insulation in the transition area between wall or ceiling does not lead to a critical situation because the pronounced thermal bridge tends to cause a higher temperature and thus lower humidity on the warm side.enInterior insulationMold growthImperfectionsBackflowbook article