Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops

Oppermann, H.H.OppermannHutter, M.M.HutterEngelmann, G.G.EngelmannReichl, H.H.Reichl2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/35035410.1117/12.600798en621Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stopsconference paper