Ramm, P.P.RammBonfert, D.D.BonfertEcke, R.R.EckeIberl, F.F.IberlKlumpp, A.A.KlumppRiedel, S.S.RiedelSchulz, S.E.S.E.SchulzWieland, R.R.WielandZacher, M.M.ZacherGessner, T.T.Gessner2022-03-092022-03-092002https://publica.fraunhofer.de/handle/publica/339676en621InterChip via technology by using copper for vertical system integrationconference paper