Reduction of heat loss of silicon membranes by the use of trench etching techniques

Werno, J.J.WernoMokwa, W.W.MokwaVogt, H.H.VogtKersjes, R.A.R.A.Kersjes2022-03-082022-03-081993https://publica.fraunhofer.de/handle/publica/321483enelectronic deviceelektronisches Gerätheat lossMembranmembraneMeßaufnehmermicrosystemMikrosystemtechniksensing elementsiliciumsiliconSubstratsubstratethermal insulationWärmeisolationWärmeverlust621Reduction of heat loss of silicon membranes by the use of trench etching techniquesconference paper