Wunderle, B.B.WunderleRas, M.A.M.A.RasSpringborn, M.M.SpringbornMay, D.D.MayKleff, J.J.KleffOppermann, H.H.OppermannTöpper, M.M.TöpperCaroff, T.T.CaroffSchacht, R.R.SchachtMitova, R.R.Mitova2022-03-122022-03-122012https://publica.fraunhofer.de/handle/publica/3789622-s2.0-84872839851This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation, thus turning it into a smart power device. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement. This paper is the first in a series of planned publications on the ongoing work in the project.en621conference paper