Beyer, E.E.BeyerWissenbach, KonradKonradWissenbachKrause, V.V.Krause2022-03-082022-03-081997https://publica.fraunhofer.de/handle/publica/303789The invention relates to a process for machining materials using diode radiation, in particular laser diode radiation. In order to achieve a matching of the beam profile to the machining process, the process is performed in such a way that the radiation emitted by numerous diodes is directed at the machining area of the workpiece using a predefined beam profile, and that a change in intensity distribution in the beam profile takes place by controlling the diode output power.de608621patent1993-4316829