Seidel, KonradKonradSeidelLehninger, DavidDavidLehningerMüller, FranzFranzMüllerRaffel, YannickYannickRaffelSünbül, AyseAyseSünbülRevello Olivo, Ricardo OrlandoRicardo OrlandoRevello OlivoHoffmann, RaikRaikHoffmannDe, SouravSouravDeKämpfe, ThomasThomasKämpfeLederer, MaximilianMaximilianLederer2023-09-122023-09-122023https://publica.fraunhofer.de/handle/publica/45053510.1109/IMW56887.2023.101459452-s2.0-85163331769In this paper we discuss the current research status of ferroelectric memory solutions and reflect it with application requirements. In focus are mainly three promising emerging memory device technologies based on ferroelectric (FE) hafnium oxide: front-end of line (FEoL) implemented FeFET, and the two FE-capacitor based solutions FeRAM and ITIC FeFET. These device technologies are discussed with respect to aspects like scaling opportunity, reliability, and maturity level, reflecting with current and future application requirements as well as conventional memory solutions.enFeFETFeRAMferroelectricsnon-volatile memoryconference paper