Navilipuri, LavakumarLavakumarNavilipuriKadam, SnehaSnehaKadamHeinig, AndyAndyHeinig2024-08-162024-08-162024-06https://publica.fraunhofer.de/handle/publica/47373410.1109/INTCEC61833.2024.10602903Multi-Chip Modules (MCMs) provide a flexible substitute for conventional System-on-Chip (SoC) designs, thereby transforming integrated circuit design. This paper explores the adoption of the Bunch-of-Wire (BoW) Die-to-Die standard as an interface link for communication between chiplets within MCMs. The BoW standard’s key features, including its low power consumption, high throughput, and compatibility across different semiconductor manufacturing processes and packaging technologies are examined. The paper also explores the architecture of the BoW Physical Interface (PHY), emphasizing its transmitter (Tx) and receiver (Rx) units and the design factors for the BoW PHY slices. Finally, the implementation of a BoW PHY receiver slice on 5nm FinFET technology, demonstrating its layout and simulation results are presented.enBunch-of-Wire (BoW)Die-to-DieFinFETPhysical (PHY) InterfaceTransmitter (Tx)Receiver (Rx)DDC::000 Informatik, Informationswissenschaft, allgemeine Werkeconference paper