Interface characterisation at electronic packages by means af nanoscale deformation analysis

Keller, J.J.KellerZander, T.T.ZanderSchulz, M.M.SchulzSpringborn, M.M.SpringbornLauenstein, T.T.LauensteinDost, M.M.DostWunderle, BernhardBernhardWunderleMichel, BerndBerndMichel2022-03-042022-03-042014https://publica.fraunhofer.de/handle/publica/238404enInterface characterisation at electronic packages by means af nanoscale deformation analysisbook article