20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019

2022-03-022022-03-022019978-1-5386-8041-4978-1-5386-8040-7978-1-5386-8039-1https://publica.fraunhofer.de/handle/publica/16441520th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019