Vogel, D.D.VogelLangheinrich, M.M.LangheinrichAuersperg, J.J.AuerspergSchubert, A.A.SchubertMichel, B.B.Michel2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/328636en621MicroDAC deformation measurement in packaging componentsconference paper