Haas, S.S.HaasVoigt, SvenSvenVoigtArnold, M.M.ArnoldSchwenzer, FalkFalkSchwenzerBraunschweig, M.M.BraunschweigKüchler, MatthiasMatthiasKüchlerKurth, SteffenSteffenKurthGeßner, ThomasThomasGeßner2022-03-132022-03-132016https://publica.fraunhofer.de/handle/publica/392594enNovel through silicon wiring technology using dry etched sloping vertical terminalsconference paper