Warnecke, H.-J.H.-J.WarneckeSchweizer, M.M.SchweizerSchoeninger, J.J.Schoeninger2022-03-022022-03-021987https://publica.fraunhofer.de/handle/publica/176094In this contribution a tactile sensor-system is presented which can be used in a broad spectrum of joining-tasks. The guarantor for the broad range of applicability is on the one hand the modular hardware-structure on the other hand the application of methods of the sample-processing at the development of joining-process (strategies). Assembly-concepts are sub-systems of the development at which a very high flexibility is guaranteed by the intensified application of sensors and KI-methods. (IPA)de670621journal article