Johansson, C.C.JohanssonUhlig, S.S.UhligTageman, O.O.TagemanAlping, A.A.AlpingHaglund, J.J.HaglundRobertsson, M.M.RobertssonPopall, M.M.PopallFröhlich, L.L.Fröhlich2022-03-032022-03-032003https://publica.fraunhofer.de/handle/publica/20355810.1109/TADVP.2003.811548Requirements of higher performance, reduced size, weight and cost of high-frequency, HF, devices has led to the search for new: materials, material combinations, methods, processes and production equipment. Efficient technologies for producing HF-circuits and integral passives are looked for. Also of interest are integrated packaging solutions for high frequency electrical packaging and optical interconnects and packaging. Sequentially build up multi-layers have been deposited on a low cost FR-4 epoxy substrate. The dielectric layers consist of a photo-patternable inorganic-organic hybrid polymer (ORMOCER1) and the metallization is Cu. An UV-exposure equipment enabling projection patterning with 5 mum resolution have been used. The produced microstrip lines, ring resonators, vias, stacked capacitors and filters have been characterized at frequencies from 1 to 40 GHz showing the potential of the new dielectric materials and processing technologies for microwave applications.en666621journal article