Photo-Resist Technology for Wafer Level Packaging and MEMS Applications

Töpper, M.M.TöpperLopper, C.C.LopperRöder, J.J.RöderHauck, K.K.HauckBaumgartner, T.T.BaumgartnerReichl, H.H.ReichlTönnies, D.D.Tönnies2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/350383en621Photo-Resist Technology for Wafer Level Packaging and MEMS Applicationsconference paper