Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substrates

Klöser, J.J.KlöserZakel, E.E.ZakelBechtold, F.F.BechtoldReichl, H.H.Reichl2022-03-092022-03-091995https://publica.fraunhofer.de/handle/publica/324877en621Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substratesconference paper