Suga, T.2022-03-022022-03-022014978-1-4799-5260-1978-1-4799-5261-8978-1-4799-5262-5https://publica.fraunhofer.de/handle/publica/1573604th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. Proceedings