Zimmermann, HeikoHeikoZimmermannFuhr, GünterGünterFuhr2024-04-042024-04-042023-12-13https://publica.fraunhofer.de/handle/publica/465738The invention relates to a method (120) for manufacturing a semiconductor chip, a semiconductor chip obtainable by the method (120), a device and a system comprising the semiconductor chip, and a method for manufacturing the system. The method (120) comprises at least the following steps: providing (121) a first trained digital artificial neural network (17); determining (122) a state of the first trained digital artificial neural network (17), the state comprising at least information about digital nodes of the first trained digital artificial neural network and information about a digital connection architecture between the digital nodes of the first trained digital artificial neural network (17); manufacturing (123) a semiconductor chip (40) comprising an analogous electrical circuit having an analogous artificial neural network (10) being designed according to the state of the first trained digital artificial neural network (17). The invention provides a fast processing artificial neural network (10) that may comprise the same complexity and that may use the same sampling of the input data as another artificial neural network, and that may complete operation during operation of the other artificial neural network.enpatentEP4290411 A1EP20220178160