Laser transmission bonding of silicon with titanium and copper layer for wafer-level packaging

Wissinger, A.A.WissingerSchmitz, M.M.SchmitzOlowinsky, A.A.OlowinskyGillner, A.A.GillnerPoprawe, R.R.Poprawe2022-03-122022-03-122012https://publica.fraunhofer.de/handle/publica/37747110.1149/05007.0189ecst2-s2.0-84885806604en621Laser transmission bonding of silicon with titanium and copper layer for wafer-level packagingconference paper