Under CopyrightErlbacher, TobiasTobiasErlbacherBauer, Anton J.Anton J.BauerFrey, LotharLotharFrey2022-03-0430.11.20122012https://publica.fraunhofer.de/handle/publica/22989510.1109/TED.2012.222077710.24406/publica-r-229895A concept for the integration of intermitted trench gates into silicon lateral double-diffused metal-oxide-semiconductor (LDMOS) devices is proposed to achieve a significant reduction in on-resistance. The trench structure can be feasibly integrated into smart-power integrated circuit technology. Using 2-D technology computer aided design (TCAD) simulations, the achievable reduction in $R_{DS, {rm on}}$ from 145 $hbox{m}Omegacdot hbox{mm}{2}$ down to 94 $hbox{m}Omegacdothbox{mm}{2}$ for a 50 V LDMOS device and the negligible impact on the blocking characteristics were demonstrated. Additionally, the device parameters were analyzed with respect to static and dynamic power dissipation. Here, the benefits of trench gate integration became more apparent. Analyzing power losses during high-frequency operation revealed that the increased input capacitance resulting from the trench gate is acceptable for applications where high switching frequencies in the upper megahertz range are not required.enMOS integrated circuitsICsPower MOSFETpower semiconductor devicesemiconductor device modelingsilicon devicescapacitanceintegrated circuitlogic gatespower dissipationstandardsswitchestopologyanalyzing powerdevice parametershigh frequency operationinput capacitanceintegrated circuit technologyLDMOS devicesmetal oxide semiconductoron-resistancestatic and dynamictechnology computer aided designtrench gates670620530621journal article