Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC

Auersperg, J.J.AuerspergSchubert, A.A.SchubertVogel, D.D.VogelMichel, B.B.MichelReichl, H.H.Reichl2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/328304en621Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDACconference paper