Auersperg, J.J.AuerspergSeiler, B.B.SeilerCadalen, E.E.CadalenDudek, R.R.DudekMichel, B.B.Michel2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/35378210.1007/1-4020-4972-2_363Increasing use under harsh environmental conditions - extreme temperatures, in particular often lead to fatigue and failure of advanced electronic packages and related systems. As a result, its thermo-mechanical reliability becomes more and more one of the most important preconditions for adopting it in industrial applications.en621conference paper