Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications

Auersperg, J.J.AuerspergMichel, B.B.Michel2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/353769en621Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applicationsconference paper