Under CopyrightHeinig, AndyAndyHeinig2022-03-148.1.20192018https://publica.fraunhofer.de/handle/publica/40293510.24406/publica-fhg-402935en5G technology5G enabled applicationintegration technologies for 60 GHzpackaging technologyAssembly Design Kit (ADK)621004Packaging and board design for 5G and millimeter wave applicationspresentation