A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

Ruffieux, D.D.RuffieuxScolari, N.N.ScolariGiroud, F.F.GiroudLe, T.C.T.C.LePiazza, S.D.S.D.PiazzaStaub, F.F.StaubZoschke, K.K.ZoschkeManier, C.A.C.A.ManierOppermann, H.H.OppermannDekker, J.J.DekkerSuni, T.T.SuniAllegato, G.G.Allegato2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/38151710.1109/ISSCC.2013.64876972-s2.0-84876527105Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.en621A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocksconference paper