Burkhardt, T.T.BurkhardtKamm, A.A.KammHornaff, M.M.HornaffBeckert, E.E.BeckertEberhardt, R.R.EberhardtTünnermann, A.A.Tünnermann2022-03-112022-03-112010https://publica.fraunhofer.de/handle/publica/366355Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of hybrid photonic systems and features a high potential for automation. Liquid solder droplets are jetted to the wetting surfaces of 3D joining geometries. A direct coupling high power fibre assembly with an adjusted multi-mode step-index fibre in front of an IR-laser diode is shown. The fibre is fixated within a solder droplet with a verticle gap of up to 50 µm and placement accuracy of 3 µm.ensolderjet bumpinglaser based solderingflux-free solderingmicro assemblyheterogenous system integration620conference paper