2022-03-022022-03-022015978-1-4799-9949-1978-1-4799-9950-7978-1-4799-9951-4https://publica.fraunhofer.de/handle/publica/15825716th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015