Ceramic Embedding as Packaging Solution for Future WBG Power Devices

CC BY-ND 4.0Bach, Hoang LinhHoang LinhBach2023-01-192023-01-192022-11-23https://publica.fraunhofer.de/handle/publica/434045https://doi.org/10.24406/publica-76410.24406/publica-764enCeramic EmbeddingPackaging SolutionEmbedding ProcessCeramic Embedding as Packaging Solution for Future WBG Power Devicespresentation