Study of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packages

Shirangi, H.H.ShirangiMüller, W.H.W.H.MüllerMichel, B.B.Michel2022-03-102022-03-102008https://publica.fraunhofer.de/handle/publica/360969en621620Study of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packagesconference paper