Brast, T.T.BrastKaiser, R.R.KaiserVelthaus, K.O.K.O.VelthausGruner, M.M.GrunerMaul, B.B.MaulHamacher, M.M.HamacherHoffmann, D.D.HoffmannSchell, M.M.Schell2022-03-112022-03-112011https://publica.fraunhofer.de/handle/publica/373577Development and characterization of monolithic, flip-chip compatible 250 Gb/s twin-IQ DQPSK MZ modulator chips - capable for hybrid assembly onto planar optical boards of advanced Tbit-capacity transmitter modules - is reported for the first time.en621Monolithic 100 Gb/s twin-IQ Mach-Zehnder modulators for advanced hybrid high-capacity transmitter boardsconference paper