Kaiser, R.R.Kaiser2022-03-092022-03-091995https://publica.fraunhofer.de/handle/publica/32534810.1109/ICIPRM.1995.5221522-s2.0-0029226356The results and experiences from the first fabrication of polarization diversity heterodyne receiver photonic integrated circuits (PICs) are reviewed and further improvements towards a possible commercial production in future are outlined. The fabrication process is based on a generic integration concept, which allows the parallel fabrication of not only heterodyne receiver PICs but also different other PIC architectures on the same wafer.endiversity receptioniii-v semiconductorsindium compoundsintegrated optoelectronicslight polarisationoptical receiversphotodiodespolarization diversity heterodyne receiver picfabricationphotonic integrated circuitscommercial productiongeneric integration conceptparallel fabricationpic architecturesinp621conference paper