Ziesche, SteffenSteffenZiescheReinhardt, KathrinKathrinReinhardtVarghese, JobinJobinVargheseManhica, BirgitBirgitManhicaSchletz, AndreasAndreasSchletz2024-03-142024-03-142023https://publica.fraunhofer.de/handle/publica/46413010.23919/EMPC55870.2023.104184392-s2.0-85186144245The presented work demonstrates our current state in embedding of SiC power electronic dies using Ceramic Multilayer Technology. The novelty of the approach presented includes the cofiring of a semiconductor element with ceramic base material, which demands for a reduced sintering temperature of ceramics (using LTCC or ULTCC based ceramics) in combination with an increased temperature stability of the semiconductor.enpower electronicsembeddingSiCLTCCULTCCMultilayer Ceramicsconference paper