Langa, SergiuSergiuLangaDrabe, ChristianChristianDrabeKunath, ChristianChristianKunathDreyhaupt, AndréAndréDreyhauptSchenk, HaraldHaraldSchenk2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/38007110.1117/12.2003525In this paper the authors report about the six inch wafer level vacuum packaging of electro-statically driven two dimensional micro-mirrors. The packaging was done by means of two types of wafer bonding methods: anodic and glass frit. The resulting chips after dicing are 4 mm wide, 6 mm long and 1.6 mm high and the residual pressure inside the package after dicing was estimated to be between 2 and 20 mbar. This allowed us to reduce the driving voltage of the micro-mirrors by more than 40% compared to the driving voltage without vacuum packaging. The vacuum stability after 5 months was verified by measurement using the so called "membrane method". Persistence of the vacuum was proven. No getter materials were used for packaging.engreen photonicswafer level vacuum packagingmicro-mirrorswafer bondingenergy efficiency621conference paper