Schröder, H.H.SchröderBrusberg, L.L.BrusbergBöttger, G.G.Böttger2022-03-122022-03-122014https://publica.fraunhofer.de/handle/publica/38733910.1109/ESTC.2014.6962732There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.en621conference paper