Brusberg, LarsLarsBrusbergWeber, D.D.WeberPernthaler, D.D.PernthalerMukhopadhyay, B.B.MukhopadhyayBöttger, G.G.BöttgerSchröder, H.H.SchröderTekin, T.T.Tekin2022-03-132024-09-302022-03-132015-10-05https://publica.fraunhofer.de/handle/publica/39041310.1109/IPCon.2015.7323521The ongoing development focuses on low-loss single-mode glass waveguide panel integration in multi-layer electro-optical circuit boards (EOCB) and optical interconnection by micro-optics to the grating couplers of such assembled silicon photonic chips.en621Silicon photonics packaging on board-levelconference paper